¡¤ Ȩ > ÀÚ·á½Ç > ÀÚ·á½Ç
¤ýÁ¦   ¸ñ Ni ħ½Ä Æò°¡¿Í Test °á°ú_ Atotech
¤ýÀÛ¼ºÀÚ ÀÌÁøÈ£
¤ýÀÛ¼ºÀÏ 2021-02-13
¤ý÷ºÎ#1 Ni_Corroion_Æò°¡_Atotech.pptx (1,671KB) (Down:246)
¤ý÷ºÎ#2 Nickel_Corrosion_ENIG_Atotech.pdf (2,322KB) (Down:612)
¤ýÁ¶È¸: 883  
Atotech¿¡¼­ ¹ßÇ¥ÇÑ ¾ÆÁÖ ÁÁÀº ±â¼úÀÚ·á¶ó Á¤¸®ÇØ º¸¾Ò½À´Ï´Ù

ÀÌÁøÈ£±â¼úÀ§¿øµå¸²
010-7506-8191
54 Sbstrate Basic_OrbotehÀÚ·á ÀÌÁøÈ£ 2021-01-17 834
53 Etch Factor¿Í ÀÓÇÇ´ø½º ÀÌÁøÈ£ 2020-12-07 1172
52 High Volume Micrsection ÀÌÁøÈ£ 2020-12-07 641
51 HDI(Microvia) PCB Design Guide ÀÌÁøÈ£ 2020-11-24 1065
50 ÀüÀå¿ë ±âÆÇÀÇ Soldering ºÒ·®°ú °³¼±´ëÃ¥ ÀÌÁøÈ£ 2020-11-24 1238
49 Hole CorrosionÀ¸·Î ÀÎÇÑ Laminate Crack ºÒ·®h ÀÌÁøÈ£ 2020-11-11 889
48 ±¹³» ÇØ¿Ü UL Logo¿Í File Number ÀÌÁøÈ£ 2020-11-04 811
47 Mitigation of glass weave skew using ÀÌÁøÈ£ 2020-10-20 1094
46 Soldering ºÒ·® Á¾·ùº° ¿ä¾à ÀÌÁøÈ£ 2020-10-10 1046
45 ¹Ì¼¼È¸·Î Á¦Á¶_»ê±â´ë ÀüÀÚ°øÇаú ÀÌÁøÈ£ 2020-10-02 1252
44 ENIG FinishÀÇ ¿°¼ÒºÐ¹« Å×½ºÆ®¿¡ ´ëÇØ ÀÌÁøÈ£ 2020-09-24 877
43 How to manufacture a PCB_NCAPw ÀÌÁøÈ£ 2020-09-23 1050
42 Wafer Level Package_HIR ÀÌÁøÈ£ 2020-09-18 613
41 ÈÞ´ëÆùÀ¸·Î º» ¹Ì¼¼È¸·Î ±â¼ú ÀÌÁøÈ£ 2020-09-18 1365
40 IPC Class 3 Design Guide_Sierra ÀÌÁøÈ£ 2020-09-10 1656
39 2019³âµµ ¼¼°è PCB ½ÃÀå ºÐ¼®_Nakahara ÀÌÁøÈ£ 2020-09-10 795
12345678