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¤ý÷ºÎ#1 GLASS_BGA_PACKAGE-TOBOARD_INTERCONNECTIONS_Á¶Áö¾ÆÅØ_¼®»ç³í¹®.pdf (5,626KB) (Down:197)
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Áöµµ ±³¼ö :Dr. Rao R. Tummala

MODELING, DESIGN, FABRICATION AND RELIABILITY CHARACTERIZATION OF ULTRA-THIN, GLASS BGA PACKAGE-TO-BOARD INTERCONNECTIONS
A Thesis
Presented to
The Academic Faculty
By
Bhupender Singh
In Partial Fulfillment
Of the Requirements of the Degree
Master of Science in the
School of Materials Science and Engineering
Georgia Institute of Technology
May 2016
COPYRIGHT © Bhupender Singh 2016
ÀÚ·á½Ç ¾È³» °ü¸®ÀÚ 2015-06-22 2831
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111 PCB Hole ¼ÓÀÇ µ¿µµ±Ý Void ºÒ·® Á¾·ù¿Í ¹ß»ý ¿øÀÎ ÀÌÁøÈ£ 2022-09-14 1511
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