¡¤ Ȩ > ÀÚ·á½Ç > ÀÚ·á½Ç
¤ýÁ¦   ¸ñ [³í¹®] Bottom-Up Filling µµ±Ý(¹«ÀüÇØ È­Çе¿)
¤ýÀÛ¼ºÀÚ °ü¸®ÀÚ
¤ýÀÛ¼ºÀÏ 2016-12-20
¤ý÷ºÎ#1 PCB_±â¼úÀÚ·á_21.hwp (13KB) (Down:778)
¤ýÁ¶È¸: 2043  
Á¦ ¸ñ
Bottom-up Fill of Copper in High Aspect Ratio Via Holes by Electroless Plating

Àú ÀÚ
S.Shingubara¿Ü 6¸í

Ãâ ó

ÀÚ·á½Ç ¾È³» °ü¸®ÀÚ 2015-06-22 3644
25 ÀÌÁøÈ£ 2024-12-08 134
24 [³í¹®] ÀÓº£µðµå ±â¼úÀÇ °úÁ¦ °ü¸®ÀÚ 2017-04-18 1664
23 [³í¹®] Àü±âµµ±Ý¿¡ ÀÇÇÑ micro-via filiing °ø¹ý¿¡¼­ ... °ü¸®ÀÚ 2017-03-24 2514
22 [³í¹®] Via&PTH Filling À§ÇÑ Àü±âµ¿µµ±Ý ÷°¡Á¦¿¡ °üÇÑ ¿¬±¸ °ü¸®ÀÚ 2017-02-21 2076
21 [³í¹®] Àμâȸ·Î±âÆÇÀÇ ¹Ì¼¼½ÅÈ£¿¬°á Ȧ Çü¼ºÀ» À§ÇÑ ·¹ÀÌÁ® µå¸±.. °ü¸®ÀÚ 2017-01-18 1846
20 [³í¹®] Bottom-Up Filling µµ±Ý(¹«ÀüÇØ È­Çе¿) °ü¸®ÀÚ 2016-12-20 2043
19 [³í¹®] PTH Filling µµ±Ý°øÁ¤ ±â¼ú °ü¸®ÀÚ 2016-11-17 1878
18 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 4-2. ÀüÀå/LED »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-07-26 1474
17 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 4-1. ÀüÀå/LED »ê¾÷ÀÇ Á¤ÀÇ ¹× ¹üÀ§ °ü¸®ÀÚ 2016-06-24 1400
16 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 3-3. µð½ºÇ÷¹ÀÌ »ê¾÷°ú PCBÀÇ °ü°è °ü¸®ÀÚ 2016-06-16 1871
15 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 3-2. µð½ºÇ÷¹ÀÌ »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-06-07 2172
14 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 3-1. µð½ºÇ÷¹ÀÌ »ê¾÷ÀÇ Á¤ÀÇ ¹× ¹üÀ§ °ü¸®ÀÚ 2016-05-10 1557
13 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 2-3. ¸ð¹ÙÀÏ »ê¾÷°ú PCBÀÇ °ü°è °ü¸®ÀÚ 2016-05-04 1147
12 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 2-2. ¸ð¹ÙÀÏ »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-04-29 1869
11 [PCB Ȱ¿ë »ê¾÷ ºÐ¼®] 2-1. ¸ð¹ÙÀÏ »ê¾÷ÀÇ Á¤ÀÇ ¹× ¹üÀ§ °ü¸®ÀÚ 2016-04-12 1555
12