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2015-06-22
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3201
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|
120 |
2024 NTI100_100´ë PCBȸ»ç
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ÀÌÁøÈ£ |
2024-10-02
|
|
258
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|
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119 |
Ultra thin Glass BGA SubstrateI
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ÀÌÁøÈ£ |
2024-08-19
|
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340
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118 |
À¯¸®±âÆÇ(Glass Core Substrate)
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ÀÌÁøÈ£ |
2024-07-26
|
|
544
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|
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117 |
Back Drill
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ÀÌÁøÈ£ |
2023-08-30
|
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880
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116 |
MicroviaºÒ·®°ú ¹ß»ý ¿øÀÎ
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ÀÌÁøÈ£ |
2023-08-29
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1150
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115 |
Microvia Process Guideline
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ÀÌÁøÈ£ |
2022-10-18
|
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1648
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114 |
ED Copper vs RA Copper
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ÀÌÁøÈ£ |
2022-10-18
|
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1092
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|
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113 |
PCB Stack Up Design Mistake
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ÀÌÁøÈ£ |
2022-09-29
|
|
1194
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112 |
Wicking(Drill Crazing)¿¡ ÀÇÇÑ CAFºÒ·®
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2022-09-14
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1321
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111 |
PCB Hole ¼ÓÀÇ µ¿µµ±Ý Void ºÒ·® Á¾·ù¿Í ¹ß»ý ¿øÀÎ
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2022-09-14
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1756
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110 |
Microvia Process Guideling
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ÀÌÁøÈ£ |
2022-09-14
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1420
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109 |
Mechanism of Ni corrosion in ENEPIG
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2022-08-18
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919
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108 |
2021³âµµ 100´ë PCB¾÷ü_NTI100
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2022-08-18
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1121
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107 |
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2022-06-10
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1602
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106 |
PCB History
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2022-03-28
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|
1498
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