¡¤ Ȩ > ÀÚ·á½Ç > ÀÚ·á½Ç
¤ýÁ¦   ¸ñ Microvia Process Guideline
¤ýÀÛ¼ºÀÚ ÀÌÁøÈ£
¤ýÀÛ¼ºÀÏ 2022-10-18
¤ý÷ºÎ#1 esa_tecmsp_tn_019672_microvia_process_guidelines_(2).pdf (282KB) (Down:2474)
¤ý÷ºÎ#2 S14_StanHeltzel-microviaprocessguidelines-IPCAPEXEXPO2021.pdf (6,838KB) (Down:1670)
¤ýÁ¶È¸: 1679  
European Space & Technology Center¿¡¼­ ¹ßÇ¥ÇÑ ¸¶ÀÌÅ©·Îºñ¾î °øÁ¤ °¡À̵å¶óÀÎÀε¥
³»¿ëÀÌ ¾ÆÁÖ ÁÁ½À´Ï´Ù

ÀÌÁøÈ£±â¼úÀ§¿øµå¸²
jhlee@keti.re.kr
ÀÚ·á½Ç ¾È³» °ü¸®ÀÚ 2015-06-22 3260
129 Æú¶õµå PCB ½ÃÀå µ¿Çâ_Kotra ÀÌÁøÈ£ 2024-12-08 29
128 OSP PCB Process ¿Í Soldering ÀÌÁøÈ£ 2024-12-08 40
127 Hole ¼Ó Solder ¹ÌÃæÁø ºÒ·® ¹ß»ý ¿øÀΰú ´ëÃ¥ ÀÌÁøÈ£ 2024-12-08 40
126 ÀÌÁøÈ£ 2024-12-08 21
125 Áß±¹ PCB ¾÷ü Ranking ÀÌÁøÈ£ 2024-12-08 33
124 HDI ÀÇ Design Guide_Sierra Circuit ÀÌÁøÈ£ 2024-12-08 26
123 Flexible PCBÀÇ Design Guide_Cierra ÀÌÁøÈ£ 2024-12-08 23
122 3DINCITESÀÇ Yearbook_2023 ÀÌÁøÈ£ 2024-12-08 18
121 ¾ç¸é PCB SPEC_PERFAG ÀÌÁøÈ£ 2024-12-08 24
120 2024 NTI100_100´ë PCBȸ»ç ÀÌÁøÈ£ 2024-10-02 289
119 Ultra thin Glass BGA SubstrateI ÀÌÁøÈ£ 2024-08-19 373
118 À¯¸®±âÆÇ(Glass Core Substrate) ÀÌÁøÈ£ 2024-07-26 621
117 Back Drill ÀÌÁøÈ£ 2023-08-30 923
116 MicroviaºÒ·®°ú ¹ß»ý ¿øÀÎ ÀÌÁøÈ£ 2023-08-29 1185
115 Microvia Process Guideline ÀÌÁøÈ£ 2022-10-18 1679
123456789