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¤ýÁ¦   ¸ñ PCB History
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¤ýÀÛ¼ºÀÏ 2022-03-28
¤ý÷ºÎ#1 HistoryBook_web.pdf (4,266KB) (Down:4881)
¤ý÷ºÎ#2 IPC_PCB_Book1958.pdf (6,584KB) (Down:1573)
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ÀÚ·á½Ç ¾È³» °ü¸®ÀÚ 2015-06-22 3201
120 2024 NTI100_100´ë PCBȸ»ç ÀÌÁøÈ£ 2024-10-02 257
119 Ultra thin Glass BGA SubstrateI ÀÌÁøÈ£ 2024-08-19 340
118 À¯¸®±âÆÇ(Glass Core Substrate) ÀÌÁøÈ£ 2024-07-26 544
117 Back Drill ÀÌÁøÈ£ 2023-08-30 880
116 MicroviaºÒ·®°ú ¹ß»ý ¿øÀÎ ÀÌÁøÈ£ 2023-08-29 1150
115 Microvia Process Guideline ÀÌÁøÈ£ 2022-10-18 1648
114 ED Copper vs RA Copper ÀÌÁøÈ£ 2022-10-18 1092
113 PCB Stack Up Design Mistake ÀÌÁøÈ£ 2022-09-29 1194
112 Wicking(Drill Crazing)¿¡ ÀÇÇÑ CAFºÒ·® ÀÌÁøÈ£ 2022-09-14 1321
111 PCB Hole ¼ÓÀÇ µ¿µµ±Ý Void ºÒ·® Á¾·ù¿Í ¹ß»ý ¿øÀÎ ÀÌÁøÈ£ 2022-09-14 1756
110 Microvia Process Guideling ÀÌÁøÈ£ 2022-09-14 1420
109 Mechanism of Ni corrosion in ENEPIG ÀÌÁøÈ£ 2022-08-18 919
108 2021³âµµ 100´ë PCB¾÷ü_NTI100 ÀÌÁøÈ£ 2022-08-18 1121
107 µ¿µµ±ÝÀÇ ¹°¼º°ú PCBÀÇ Ç°Áú ¹× ½Å·Ú¼º ÀÌÁøÈ£ 2022-06-10 1602
106 PCB History ÀÌÁøÈ£ 2022-03-28 1498
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