¡¤ Ȩ > ÀÚ·á½Ç > ÀÚ·á½Ç
¤ýÁ¦   ¸ñ Ultra thin Glass BGA SubstrateI
¤ýÀÛ¼ºÀÚ ÀÌÁøÈ£
¤ýÀÛ¼ºÀÏ 2024-08-19
¤ý÷ºÎ#1 GLASS_BGA_PACKAGE-TOBOARD_INTERCONNECTIONS_Á¶Áö¾ÆÅØ_¼®»ç³í¹®.pdf (5,626KB) (Down:888)
¤ýÁ¶È¸: 465  
ÁÒÁö¾ÆÅØÀÇ ¼®»çÇÐÀ§ ³í¹®Àε¥ °øºÎÇϱâ ÁÁÀº ÀÚ·áÀÔ´Ï´Ù
Áöµµ ±³¼ö :Dr. Rao R. Tummala

MODELING, DESIGN, FABRICATION AND RELIABILITY CHARACTERIZATION OF ULTRA-THIN, GLASS BGA PACKAGE-TO-BOARD INTERCONNECTIONS
A Thesis
Presented to
The Academic Faculty
By
Bhupender Singh
In Partial Fulfillment
Of the Requirements of the Degree
Master of Science in the
School of Materials Science and Engineering
Georgia Institute of Technology
May 2016
COPYRIGHT © Bhupender Singh 2016
ÀÚ·á½Ç ¾È³» °ü¸®ÀÚ 2015-06-22 3395
138 ENIG ¿Í ENEPIG¿¡¼­ÀÇ Nickel ħ½Ä ¹®Á¦ ÀÌÁøÈ£ 2025-02-14 9
137 À¯¸®±âÆÇ°ú CPO ÀÌÁøÈ£ 2025-02-14 8
136 ºÐ¼®Àåºñ¸¦ ÀÌ¿ëÇÑ PCBÀÇ °áÇÔ ºÐ¼® »ç·Êµé ÀÌÁøÈ£ 2025-01-21 50
135 ¹ÝµµÃ¼ ½Ç¸®ÄÜ Æ÷Åä´Ð½º°¡ ºÒ·¯¿Â ±Û¶ó½º ±âÆÇ ½ÃÀåÀÇ °³È­_ Çö´ë.. ÀÌÁøÈ£ 2025-01-21 63
134 Áß±¹ÀÇ IPC È°µ¿µé_IPC EMACµî ÀÌÁøÈ£ 2025-01-21 27
133 High-Speed Constraint Values PCB Layout ÀÌÁøÈ£ 2025-01-08 97
132 ¹Ì¸®º¸´Â CES2025 ÀÌÁøÈ£ 2025-01-02 94
131 FR-5 ¿øÆÇ°ú À¯·Æ È­Àç ¹æÈ£ ±Ô°Ý EN45545 ¿ä±¸»çÇ× ÀÌÁøÈ£ 2025-01-02 59
130 Future of the semiconductor industry ÀÌÁøÈ£ 2024-12-31 70
129 Æú¶õµå PCB ½ÃÀå µ¿Çâ_Kotra ÀÌÁøÈ£ 2024-12-08 94
128 OSP PCB Process ¿Í Soldering ÀÌÁøÈ£ 2024-12-08 115
127 Hole ¼Ó Solder ¹ÌÃæÁø ºÒ·® ¹ß»ý ¿øÀΰú ´ëÃ¥ ÀÌÁøÈ£ 2024-12-08 128
126 ÀÌÁøÈ£ 2024-12-08 60
125 Áß±¹ PCB ¾÷ü Ranking ÀÌÁøÈ£ 2024-12-08 129
124 HDI ÀÇ Design Guide_Sierra Circuit ÀÌÁøÈ£ 2024-12-08 83
123456789