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H. Tanaka, ±è±Ù¼ö

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Journal of the Microelectronics & Packaging Society
Vol. 19, No. 4, p. 1-5. 2012

27 Fundermentas of PCB Technology ÀÌÁøÈ£ 2020-05-22 1092
26 PCB¿ë¾î»çÀü ÀÌÁøÈ£ 2020-05-08 2130
25 Wave soldering ¿Ï·áÈÄ Lead µ¹Ãâ±æÀÌ Spec ÀÌÁøÈ£ 2020-05-08 1488
24 [³í¹®] ÀÓº£µðµå ±â¼úÀÇ °úÁ¦ °ü¸®ÀÚ 2017-04-18 1514
23 [³í¹®] Àü±âµµ±Ý¿¡ ÀÇÇÑ micro-via filiing °ø¹ý¿¡¼­ ... °ü¸®ÀÚ 2017-03-24 2369
22 [³í¹®] Via&PTH Filling À§ÇÑ Àü±âµ¿µµ±Ý ÷°¡Á¦¿¡ °üÇÑ ¿¬±¸ °ü¸®ÀÚ 2017-02-21 1939
21 [³í¹®] Àμâȸ·Î±âÆÇÀÇ ¹Ì¼¼½ÅÈ£¿¬°á Ȧ Çü¼ºÀ» À§ÇÑ ·¹ÀÌÁ® µå¸±.. °ü¸®ÀÚ 2017-01-18 1671
20 [³í¹®] Bottom-Up Filling µµ±Ý(¹«ÀüÇØ È­Çе¿) °ü¸®ÀÚ 2016-12-20 1940
19 [³í¹®] PTH Filling µµ±Ý°øÁ¤ ±â¼ú °ü¸®ÀÚ 2016-11-17 1754
18 [PCB È°¿ë »ê¾÷ ºÐ¼®] 4-2. ÀüÀå/LED »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-07-26 1411
17 [PCB È°¿ë »ê¾÷ ºÐ¼®] 4-1. ÀüÀå/LED »ê¾÷ÀÇ Á¤ÀÇ ¹× ¹üÀ§ °ü¸®ÀÚ 2016-06-24 1328
16 [PCB È°¿ë »ê¾÷ ºÐ¼®] 3-3. µð½ºÇ÷¹ÀÌ »ê¾÷°ú PCBÀÇ °ü°è °ü¸®ÀÚ 2016-06-16 1756
15 [PCB È°¿ë »ê¾÷ ºÐ¼®] 3-2. µð½ºÇ÷¹ÀÌ »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-06-07 2098
14 [PCB È°¿ë »ê¾÷ ºÐ¼®] 3-1. µð½ºÇ÷¹ÀÌ »ê¾÷ÀÇ Á¤ÀÇ ¹× ¹üÀ§ °ü¸®ÀÚ 2016-05-10 1493
13 [PCB È°¿ë »ê¾÷ ºÐ¼®] 2-3. ¸ð¹ÙÀÏ »ê¾÷°ú PCBÀÇ °ü°è °ü¸®ÀÚ 2016-05-04 1079
12 [PCB È°¿ë »ê¾÷ ºÐ¼®] 2-2. ¸ð¹ÙÀÏ »ê¾÷ÀÇ ¹ßÀü ¹æÇâ °ü¸®ÀÚ 2016-04-29 1785
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